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A recent PlayStation patent indicates that the PS6 will likely overcome the overheating issues faced by the PS5 through the implementation of cutting-edge cooling technology. The PS5’s liquid metal cooling system reportedly caused damage to some launch units when the console was positioned vertically — a problem Sony addressed with the release of the PS5 Slim and PS5 Pro. It appears that the PS6 will incorporate a new cooling method altogether.
As uncovered by Tech4Gamers, Sony Interactive Entertainment has filed a patent that explicitly mentions “demand for structures with higher cooling performance” in various device orientations. The patent describes a “heat dissipation device that includes a heat pipe and a heat sink,” designed to cool components such as integrated circuit (IC) chips within electronic devices.
The patent details that each heat pipe might feature a sintered body layer formed by sintering a powdered material, such as metal, onto the inner surface of a tube, including its outer layer. These sintered bodies are cylindrical within the pipe, with a cavity inside, and a working fluid sealed inside — potentially just water, depending on the pipe’s material.
Sony notes that the selection of the cooling fluid will depend on the pipe’s substance, with water being a simple yet effective option. While patents don’t always translate directly into future products, this advanced cooling technology seems poised to be part of the PS6’s design.
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