Lens Technology, a prominent Chinese manufacturer specializing in precision components, has entered into a memorandum of understanding with a leading U.S. semiconductor company to collaboratively advance through-glass via (TGV) packaging technology. This move signals a strategic expansion into semiconductor packaging.
The agreement highlights TGV packaging as the main focus for joint efforts. The companies will explore and assess potential projects involving critical manufacturing processes, such as TGV techniques, high-precision laser processing, plated through-hole (PTH) metallization, and multi-layer interconnection, according to a statement from the Changsha-based firm.
TGV glass substrates are increasingly recognized as vital platforms for AI computing chips and co-packaged optics due to their minimal thermal deformation, high-frequency performance, low signal loss, and suitability for mass production.
Under this partnership, the U.S. partner considers Lens Technology a valuable potential collaborator in TGV packaging, aiming to share technical specifications and support efforts to incorporate this technology into AI chip packaging. However, specific cooperation projects will require formal agreements before proceeding.
The collaboration also aims to explore complementary areas such as AI personal computers, modules, high-reliability structural components, cooling modules for data centers, embodied AI robots, industrial intelligent devices, and edge computing hardware.
Lens Technology has developed extensive expertise in TGV precision machining, micro-hole formation, PTH metallization, and multi-layer interconnection, establishing pilot production lines and conducting sample trials. The company believes this partnership will foster a long-term strategic relationship grounded in mutual trust.
This alliance with the U.S. semiconductor firm is expected to accelerate the commercialization of advanced glass substrate packaging technology. It will also support Lens Technology’s transition from consumer electronics structural parts into the semiconductor packaging substrate market, deepening its integration into the global computing hardware supply chain.
Prior to this collaboration, a notable joint project between a Chinese display panel maker and a U.S. glass manufacturer involved the development of TGV-based advanced packaging substrates.
Today, the company’s stock closed down by 1.9%, trading at CNY36.63 (USD5.40). Since reaching a record high on June 25, the stock has declined nearly 40%.